US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 5 for "Methods and systems for improving surface mount joinder" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,587, issued on Aug. 5, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods and systems for improving surface mount joinder" was invented by Hsien-Wen Liu (Hsinchu, Taiwan), Shih-Ting Hung (Sanchong, Taiwan), Jyun-Lin Wu (Hsinchu, Taiwan), Yao-Chun Chuang (Hsinchu, Taiwan) and Yinlung Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for improving joinder between a surface-mount package and a printed circuit board are disclosed. The warpage at a corner of the surface-mount package and at a corresponding corner of a joint area on the printed circuit board are measured to determine the deg...