US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 5 for "Method of making semiconductor structure including buffer layer" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,166, issued on Aug. 5, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of making semiconductor structure including buffer layer" was invented by Gulbagh Singh (Hsinchu, Taiwan), Chih-Ming Lee (Hsinchu, Taiwan), Chi-Yen Lin (Hsinchu, Taiwan), Wen-Chang Kuo (Hsinchu, Taiwan) and C. C. Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a semiconductor structure includes forming a first contact pad over an interconnect structure. The method further includes forming a second contact pad over the interconnect structure, wherein the second contact pad is electrically separated fr...