US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 5 for "Layout design for header cell in 3D integrated circuits" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,724, issued on Aug. 5, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Layout design for header cell in 3D integrated circuits" was invented by Cheng-Yu Lin (Hsinchu, Taiwan), Po-Hsiang Huang (Tainan, Taiwan), Pochun Wang (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan) and Fong-Yuan Chang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method for manufacturing a semiconductor device are provided. The semiconductor device comprises a substrate, a conductive element disposed within a first region of the substrate, and a first transistor disposed within a second...