ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,210, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Wafer test pad" was invented by Chih-Pin Chiu (Hsinchu, Taiwan), Zhen De Ma (New Taipei, Taiwan), Lee-Wen Hsu (Hsinchu, Taiwan), Liang-Wei Wang (Hsinchu County, Taiwan) and Dian-Hau Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A redistribution structure is provided. A redistribution structure according to the present disclosure includes a first dielectric layer, a mesh metal feature disposed in the first dielectric layer and including a base portion and a frame portion surrounding the base portion, a second dielectric l...