US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Stacked memory cube with integrated thermal path for enhanced heat dissipation" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,936, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stacked memory cube with integrated thermal path for enhanced heat dissipation" was invented by Lipu Kris Chuang (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan), Han-Ping Pu (Taichung, Taiwan), Hsin-Yu Pan (Taipei, Taiwan), Ming-Kai Liu (Hsinchu, Taiwan) and Ting-Chu Ko (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device including a base chip and a memory cube mounted on and connected with the base chip is described. The memory cube includes multiple stacked tiers, and each tier of the multiple stacked tiers includes...