US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 26 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,345, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Yun-Ju Fan (Hsinchu, Taiwan), Lin-Yu Huang (Hsinchu, Taiwan), Sheng-Tsung Wang (Hsinchu, Taiwan), Huan-Chieh Su (Changhua County, Taiwan), Cheng-Chi Chuang (New Taipei, Taiwan) and Chih-Hao Wang (Baoshan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided, and includes a first fin structure, a second fin structure, and a third fin structure over a substrate. The second fin structure is located between the first fin structu...