US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 26 for "Semiconductor structure" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,394, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure" was invented by I-Ming Chang (Hsinchu, Taiwan), Chung-Liang Cheng (Changhua County, Taiwan), Hsiang-Pi Chang (New Taipei, Taiwan), Hung-Chang Sun (Kaohsiung, Taiwan), Yao-Sheng Huang (Kaohsiung, Taiwan), Yu-Wei Lu (Taipei, Taiwan), Fang-Wei Lee (Hsinchu, Taiwan), Ziwei Fang (Hsinchu, Taiwan) and Huang-Lin Chao (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first fin structure and a second fin structure, a first dielectric layer disposed over the first fin structure,...