ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,994, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor placing in packaging" was invented by Jen-Yuan Chang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for placing a semiconductor onto a substrate is provided. The method includes the following steps: transferring, using a placement tool, the semiconductor along a path over onto the substrate; lowering, using the placement tool, the semiconductor to a predetermined height above the substrate; titling, using the placement tool, the semiconductor, to a predetermined angle; determining, using the placement tool, ...