US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Semiconductor fabrication apparatus and method of using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,432, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hisinchu, Taiwan).

"Semiconductor fabrication apparatus and method of using the same" was invented by Yu-Der Chih (Hsinchu, Taiwan), May-Be Chen (Hsinchu, Taiwan), Ya-Chin King (Taipei, Taiwan), Chrong Jung Lin (Hsinchu, Taiwan), Burn Jeng Lin (Hsinchu, Taiwan) and Bo Yu Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor fabrication apparatus and a method of using the same are disclosed. In one aspect, the apparatus includes a holder configured to place a substrate and a radiation source configured to provide radiation to transfer a p...