US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 26 for "Semiconductor device structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,364, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and method for forming the same" was invented by Kuan-Hao Cheng (Hsinchu, Taiwan), Wei-Yang Lee (Taipei, Taiwan), Tzu-Hua Chiu (Hsinchu, Taiwan), Wei-Han Fan (Hsin-Chu, Taiwan), Po-Yu Lin (New Taipei, Taiwan) and Chia-Pin Lin (Xinpu Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin over the base. The semiconductor device structure includes a gate stack over a ...