US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 26 for "Semiconductor arrangement with airgap and method of forming" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,389, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Semiconductor arrangement with airgap and method of forming" was invented by Gulbagh Singh (Tainan, Taiwan), Wang Po-Jen (Taichung, Taiwan), Kun-Tsang Chuang (Miaoli, Taiwan) and Tsung-Han Tsai (Zhunan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor arrangement includes a gate structure disposed between a first source/drain region and a second source/drain region and a first contact disposed over the first source/drain region. The semiconductor arrangement includes a second contact disposed over the second sour...