ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,313, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Optical inspection of a wafer" was invented by Chih-Lieh Chen (Yilan County, Taiwan), Cheng-Kang Hu (Kaohsiung, Taiwan), Cheng-Lung Wu (Zhunan Township, Taiwan) and Jiun-Rong Pai (Jhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device may binari...