US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Methods of manufacture having redistribution layer using dielectric material photoactive component" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,876, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co Ltd. (Hsinchu, Taiwan).

"Methods of manufacture having redistribution layer using dielectric material photoactive component" was invented by Wei-Chih Chen (Taipei, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan) and Sih-Hao Liao (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A passivation layer and conductive via are provided, wherein the transmittance of an imaging energy is increased within the material of the passivation layer. The increase in transmittance allows for a greater cross-linking that helps to increase control over...