US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Isolation structure for bond pad structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,984, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Isolation structure for bond pad structure" was invented by Sin-Yao Huang (Tainan, Taiwan), Jeng-Shyan Lin (Tainan, Taiwan), Shih-Pei Chou (Tainan, Taiwan) and Tzu-Hsuan Hsu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a method for forming an integrated chip including a substrate having an upper surface vertically below a top surface. A dielectric structure contacts the top surface of the substrate. A conductive structure is disposed in the substrate. The condu...