US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Interconnect structures and methods and apparatuses for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,862, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interconnect structures and methods and apparatuses for forming the same" was invented by Chun-Hsu Yang (Hsinchu, Taiwan), Chun-Sheng Chen (Hsinchu, Taiwan), Nai-Hao Yang (Keelung, Taiwan), Kuan-Chia Chen (Hsinchu, Taiwan), Huei-Wen Hsieh (Hsinchu, Taiwan), Yu-Cheng Hsiao (Taipei, Taiwan) and Che-Wei Tien (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interconnect structures and methods and apparatuses for forming the same are disclosed. In an embodiment, a method includes supplying a process gas to a process chamber; igniting the...