US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Integrated circuit with backside power rail and backside interconnect" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,415, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit with backside power rail and backside interconnect" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Guo-Huei Wu (Hsinchu, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes metal rails. The integrated circuit includes a first layer including a first metal rail and a second layer including a second metal rail, where the second layer is above the first layer along a first direction. The integrated circuit includes a third layer including an active region of ...