US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,878, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Shih Ting Lin (Taipei, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan), Shang-Yun Hou (Jubei, Taiwan), Chi-Hsi Wu (Hsinchu, Taiwan) and Weiming Chris Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attaching semiconductor devices to an interposer structure, attaching the interposer structure to a first carrier substrate, attaching integrated passive devices to the first carrier substrate, forming an encapsulant over the semiconduc...