ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,928, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Heat dissipation structures" was invented by Yun-Wei Cheng (Taipei, Taiwan), Chun-Hao Chou (Tainan, Taiwan), Kuo-Cheng Lee (Tainan, Taiwan) and Ying-Hao Chen (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes heat dissipation structures formed in functional or non-functional areas of a three-dimensional chip structure. These heat dissipation structures are configured to route the heat generated within the three-dimensional chip structure to designated areas on or outside the three-dimensional chip struc...