US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "FETS and methods of forming FETS" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,344, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"FETS and methods of forming FETS" was invented by Tzu-Ching Lin (Hsinchu, Taiwan), Wei Te Chiang (Chiayi, Taiwan), Wei Hao Lu (Taoyuan, Taiwan), Chii-Horng Li (Zhubei, Taiwan), Chien-I Kuo (Chiayi, Taiwan) and Li-Li Su (ChuBei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment is a method including forming a raised portion of a substrate, forming fins on the raised portion of the substrate, forming an isolation region surrounding the fins, a first portion of the isolation region being on a top surface of the raised portion of the...