ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,834, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Cantilever with etch chamber flow design" was invented by Chien-Liang Chen (New Taipei, Taiwan), Chien-Yu Wang (Hsinchu, Taiwan), Wei-Da Chen (Hsinchu County, Taiwan), Yu-Ning Cheng (Hsinchu, Taiwan), Shih-tsung Chen (New Taipei, Taiwan) and Yung-Yao Lee (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cantilever for gas flow direction control configured to support an electrode housing bowl in an associated etch process chamber. The cantilever may have a cross-section that is circular, elliptical, or airfoil shaped. The...