US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Arrangement of power-grounds in package structures" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,989, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Arrangement of power-grounds in package structures" was invented by Ting-Yu Yeh (Hsinchu, Taiwan), Chun-Hua Chang (Zhubei, Taiwan), Fong-Yuan Chang (Hsinchu, Taiwan) and Jyh Chwen Frank Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plural...