US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 19 for "Underfill cushion films for packaging substrates and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,698, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Underfill cushion films for packaging substrates and methods of forming the same" was invented by Chia-Kuei Hsu (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a fan-out package comprising at least one semiconductor die, a redistribution structure comprising fan-out bonding pads, and a first underfill material portion, a packaging substrate comprising ...