ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,392,961, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Structure and process for photonic packages" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Hsing-Kuo Hsia (Jhubei, Taiwan) and Kuo-Chiang Ting (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of forming the semiconductor devices are described herein. A method includes providing a first material layer between a second material layer and a semiconductor substrate and forming a first waveguide in the second material layer. The method also includes forming a photonic die over the first waveguide and fo...