ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,611, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor tool for copper deposition" was invented by Chia-Hung Tsai (Hsinchu County, Taiwan), Chin-Szu Lee (Taoyuan, Taiwan), Szu-Hua Wu (Zhubei, Taiwan), Jui-Hung Ho (Hsinchu, Taiwan), Chi-Hung Liao (Hsinchu, Taiwan) and Yu-Jen Chien (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A magnetic shield reduces external noise in a chamber including a target and at least one electromagnet for copper physical vapor deposition (PVD). The shield may have a thickness in a range from approximately 0.1 mm to approximately 10 mm to provid...