US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 19 for "Semiconductor structures and methods of forming the same" (Taiwanese, Trinidadian Or Tobagonian Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,251, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structures and methods of forming the same" was invented by Ni-Wan Fan (Miao-Li County, Taiwan), Jung-Chan Yang (Taoyuan County, Taiwan), Hsiang-Jen Tseng (Hsinchu, Taiwan), Tommy Hu (Hsinchu, Trinidad and Tobago), Chi-Yu Lu (New Taipei, Taiwan) and Wei-Ling Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures and methods for forming a semiconductor structure are provided. The method includes forming a first active semiconductor region disposed in a first vertical level of the semiconductor s...