US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 19 for "Packages with metal line crack prevention design" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,758, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Packages with metal line crack prevention design" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan), Der-Chyang Yeh (Hsinchu, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Jie Chen (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corne...