US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 19 for "Lamination process, and manufacturing method of semiconductor package using a chuck" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,033, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Lamination process, and manufacturing method of semiconductor package using a chuck" was invented by Wei-Jie Huang (Hsinchu, Taiwan), Yu-Ching Lo (Hsinchu, Taiwan), Ching-Pin Yuan (Hsinchu, Taiwan), Wen-Chih Lin (Hsinchu, Taiwan), Cheng-Yu Kuo (Kaohsiung, Taiwan), Yi-Yang Lei (Taichung, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polyme...