US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 19 for "Isolation structures of semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,191, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd..

"Isolation structures of semiconductor devices" was invented by Jia-Chuan You (Dayuan Township, Taiwan), Li-Yang Chuang (Hsinchu, Taiwan), Chih-Hao Wang (Baoshan Township, Taiwan), Shi Ning Ju (Hsinchu, Taiwan) and Kuo-Cheng Chiang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a first vertical structure and a second vertical structure formed over the substrate, and an isolation structure between the first...