US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 19 for "Integrated circuit packages having adhesion layers for through vias" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,741, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages having adhesion layers for through vias" was invented by Hung-Chun Cho (Hsinchu, Taiwan), Sih-Hao Liao (New Taipei, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a semiconductor die including a semiconductor material; a through via adjacent the semiconductor die, the through via including a metal; an encapsulant around the through via and the semiconductor die, the encapsulant including a polymer resin; and an...