US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 19 for "Apparatus for manufacturing a bonded semiconductor structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,643, issued on Aug. 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Apparatus for manufacturing a bonded semiconductor structure and method for manufacturing the same" was invented by Jen-Yuan Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for manufacturing a bonded semiconductor structure includes a wafer processing unit including a first and second bonding chambers; a wafer transfer module including a first chamber coupled to the first and second bonding chambers, wherein the wafer transfer module is configured to transport a wafer within the first chamber and into and out...