ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,283, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).
"3DIC seal ring structure and methods of forming same" was invented by Cheng-Ying Ho (Minxiong Township, Taiwan), Pao-Tung Chen (Tainan Hsien, Taiwan), Wen-De Wang (Minsyong Township, Taiwan), Jen-Cheng Liu (Hsinchu, Taiwan) and Dun-Nian Yaung (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor chip including a first substrate, a plurality of first dielectric layers and a plurality of conductive lines formed in the first dielectric layers over the first substrate. The semiconductor d...