US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Wafer test system and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,967, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer test system and methods" was invented by Jyu-Hua Hsiao (Hsinchu, Taiwan), Chun-Yu Lin (Hsinchu, Taiwan), Chien Fang Huang (Hsinchu, Taiwan), Kam Heng Lee (Hsinchu, Taiwan) and Jiun-Rong Pai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: positioning a wafer in a first probe chamber of a first probe apparatus by a robot arm, the first probe apparatus being adjacent a transfer rail, the robot arm, in operation, moving along the transfer rail; testing the wafer by the first probe apparatus; following the testi...