US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Three dimensional integrated circuit with monolithic inter-tier vias (MIV)" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,013, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Three dimensional integrated circuit with monolithic inter-tier vias (MIV)" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Jiann-Tyng Tzeng (Hsin Chu, Taiwan), Kam-Tou Sio (Zhubei, Taiwan), Wei-Cheng Lin (Taichung, Taiwan) and Wei-An Lai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A monolithic three-dimensional (3D) integrated circuit (IC) device includes a lower tier including a lower tier cell and an upper tier arranged over the lower tier. The upper tier has a first upper tier cell and a second upper tier cell separated b...