US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Semiconductor structures including glass core layer and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,945, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structures including glass core layer and methods of forming the same" was invented by Jing-Ye Juang (Hsinchu, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor structure includes the following operations. First deep vias are formed in a first glass layer. A first redistribution layer structure is formed on a first side of the first glass layer, and the first redistribution layer structure is electrically connected to the fir...