ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,997, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor packages" was invented by Yi-Jung Chen (Yilan County, Taiwan), Wei-An Tsao (Changhua County, Taiwan), Tsung-Fu Tsai (Changhua County, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first integrated circuit, a plurality of first through vias and a plurality of fin-shaped through vias. The first through vias surround the first integrated circuit. The fin-shaped through vias are physically connected to the first through vias respectively, wherein the first throug...