ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,041, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package" was invented by Kris Lipu Chuang (Hsinchu, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan), Tzu-Sung Huang (Tainan, Taiwan) and Hsin-Yu Pan (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate, a redistribution circuit layer, and a protective layer. The redistribution circuit layer is over the substrate and includes a plurality of functional pads electrically connected to the substrate, and a dummy pad pattern electrically disconnected from the plurality of functional pad...