US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 12 for "Semiconductor devices and methods of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,653, issued on Aug. 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor devices and methods of fabricating the same" was invented by Chun-Fai Cheng (Hong Kong, Taiwan), Chang-Miao Liu (Hsinchu, Taiwan) and Ming-Lung Cheng (Kaohsiung County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods are provided. An exemplary method according to the present disclosure includes providing fin-shaped active regions protruding from a substrate, forming cladding layers extending along sidewalls of the fin-shaped active regions, forming a dielectric feature over the substrate to...