US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 12 for "Self-aligned scheme for semiconductor device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,977, issued on Aug. 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Self-aligned scheme for semiconductor device and method of forming the same" was invented by Hsiu-Wen Hsueh (Taichung, Taiwan), Cai-Ling Wu (Hsinchu, Taiwan), Ya-Ching Tseng (Hsinchu, Taiwan), Chii-Ping Chen (Hsinchu, Taiwan) and Neng-Jye Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises an interlayer dielectric (ILD) layer disposed over a substrate; a first conductive feature at least partially embedded in...