US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 12 for "Scan architecture for interconnect testing in 3D integrated circuits" (Canadian, American, Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,973, issued on Aug. 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Scan architecture for interconnect testing in 3D integrated circuits" was invented by Sandeep Kumar Goel (Dublin, Calif.), Yun-Han Lee (Boashan Township, Taiwan), Saman M.I. Adham (Kanata, Canada) and Marat Gershoig (Ottawa).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a seco...