US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Patterning interconnects and other structures by photo-sensitizing method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,974, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Patterning interconnects and other structures by photo-sensitizing method" was invented by Wei-Jen Lo (Hsinchu, Taiwan), Po-Cheng Shih (Hsinchu, Taiwan), Syun-Ming Jang (Hsinchu, Taiwan) and Tze-Liang Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A representative method includes forming a photo-sensitive material over a substrate, and forming a cap layer over the photo-sensitive material, and patterning the cap layer. Using the patterned cap layer, a first portion of the photo-sensitive material is selectively exposed to a pr...