ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,028, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Yi-Wen Wu (New Taipei, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan), Shih-Ting Hung (New Taipei, Taiwan) and Po-Yao Chuang (Hsin-Chu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a redistribution structure, a first semiconductor die, a first passive component, a second semiconductor die, a first insulating encapsulant, a second insulating encapsulant, a second passive component and a global shielding structure. The redistribution structure includes dielectric layers and conductiv...