US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Package and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,992, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package and method for forming the same" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Chien-Tung Yu (Hsinchu, Taiwan), Chia-Hsiang Lin (Zhubei, Taiwan), Chin-Hua Wang (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a package including: a redistribution structure including a first dielectric layer and a first conductive element disposed in the first dielectric layer; a first semiconductor device bonded to the redistribution structure, wherein the first semiconductor device i...