US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Method of manufacturing semiconductor package having lid structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,988, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of manufacturing semiconductor package having lid structure" was invented by Tsung-Shu Lin (New Taipei, Taiwan), Wensen Hung (Hsinchu County, Taiwan) and Tsung-Yu Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor package includes the following steps. A package structure is provided over a substrate. A thermal interface layer is provided over the package structure. A lid structure is provided over the substrate, wherein the lid structure comprises a main body in contact with the pa...