US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Manufacturing method of semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,991, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor package" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Che-Chia Yang (Taipei, Taiwan), Chin-Hua Wang (New Taipei, Taiwan), Yu-Sheng Lin (Hsinchu County, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor package includes the following steps. A first semiconductor device is provided over a substrate, wherein the first semiconductor device is offset toward an edge of the substrate. A ring struc...