US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "Facet profile to improve edge coupler beam pointing and coupling efficiency for photonics" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,119, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Facet profile to improve edge coupler beam pointing and coupling efficiency for photonics" was invented by Wei-Kang Liu (Taichung, Taiwan), Chih-Tsung Shih (Hsinchu, Taiwan), Hau-Yan Lu (Hsinchu, Taiwan) and Yingkit Felix Tsui (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated circuit. The integrated circuit includes a substrate having an upper face and a lower face. The upper face includes a central region and an outer sidewall that laterally surrounds...