US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 12 for "Deep lines and shallow lines in signal conducting paths" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,016, issued on Aug. 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Deep lines and shallow lines in signal conducting paths" was invented by Wei-An Lai (Hsinchu, Taiwan), Te-Hsin Chiu (Hsinchu, Taiwan), Shih-Wei Peng (Hsinchu, Taiwan), Wei-Cheng Lin (Hsinchu, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan) and Chia-Tien Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a plurality of first layer deep lines, a plurality of first layer shallow lines, a plurality of second layer deep lines, and a plurality of second layer shallow lines. The integrated circuit also inclu...