US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 12 for "Chip package structure with metal-containing layer" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,003, issued on Aug. 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip package structure with metal-containing layer" was invented by Yu-Huan Chen (Taoyuan, Taiwan), Kuo-Ching Hsu (New Taipei, Taiwan) and Chen-Shien Chen (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a first wiring substrate comprising a substrate, a first pad, a second pad, and an insulating layer. The first pad and the second pad are respectively over a first surface and a second surface of the substrate, the first surface is opposite to the second su...