US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 12 for "3D IC comprising semiconductor substrates with different bandgaps" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,039, issued on Aug. 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"3D IC comprising semiconductor substrates with different bandgaps" was invented by Yao-Chung Chang (Zhubei, Taiwan), Shih-Chien Liu (Hsinchu County, Taiwan), Chia-Jui Yu (Hsinchu County, Taiwan) and Chun-Lin Tsai (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a three-dimensional (3D) IC comprising semiconductor substrates with different bandgaps. The 3D IC chip comprises a first IC chip and a second IC chip overlying and bonded to the first IC chip. The first IC c...