US Patent Issued to Taiwan Semiconductor Manufacturing on April 8 for "Wafer chuck structure with holes in upper surface to improve temperature uniformity" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,585, issued on April 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer chuck structure with holes in upper surface to improve temperature uniformity" was invented by Ting-Jung Chen (Kaohsiung, Taiwan), Shih-Wei Lin (Taipei, Taiwan) and Lee-Chuan Tseng (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to a process tool that includes a chamber housing defined by a processing chamber, and a wafer chuck structure arranged within the processing chamber. The wafer chuck structure is configured to hold a wafer during a fabrication process. The wafer ...