US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 8 for "Semiconductor topography simulation of non-removal type processes" (Taiwanese, American Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,043, issued on April 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor topography simulation of non-removal type processes" was invented by Zhengping Jiang (Hsinchu, Taiwan), Nuo Xu (San Jose, Calif.), Ji-Ting Li (Hsinchu, Taiwan), Yuan Hao Chang (Hsinchu, Taiwan), Zhiqiang Wu (Hsinchu County, Taiwan) and Wen-Hsing Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for topography simulation of a physical structure under a topography-changing process. The method includes initializing a voxel mesh as a three-dimensional (3D) representation of...